Ak32d300sram datasheet, ak32d300sram pdf, ak32d300sram data sheet, ak32d300sram manual, ak32d300sram pdf, ak32d300sram, datenblatt, electronics ak32d300sram. An active low write enable signal we controls the writingreading operation of the memory. Soj and solj small outline jlead is used to describe sol packages with j leads. Request issi, integrated silicon solution inc is41lv16100b60tl. Sep 10, 2015 the cy7c185 is in a standard 300milwide dip, soj, or soic package. This device is manufactured using winbonds high performance cmos technology.
As7c4 online ordering as7c4 brand manufactures pdf. May 1997 1 revision a14 general description the w24257a is a high speed, low power cmos static ram organized as 32768. The device features three enable inputs e1 and e2 and e3. Buy d42275alfa15 nec, view the manufacturer, and stock, and datasheet pdf for the d42275alfa15 at jotrin electronics. Ak08d300hsop pdfak08d300hsop microcircuit corporation accutek small outline package soic, soj and plcc dip. They are generally available in the same pinouts as their counterpart dip ics. Green parts available, see ordering information description the idt71v416 is a 4,194,304bit highspeed static ram organized as 256k x 16. Packaging information notes p and bold letter denotes preferred package code a t suffix added to the pack aging codes for sma, smb and smc products indicates that the patented folded frame cons truction is used. The engineers will enjoy the small batch ordering service for gm71c from stock suppliers here. Upd431016le17b nec nec corporation jotrin electronics.
Surface mounting type package sop, qfp, soj, qfj, bga tape carrier tcp cob, tcp, etc. Kynix will provide you the global and original gm71cs stock information, reference price, package lot no. Package classifications 9 package name characteristics dual inline package dip packages are hermetic ceramic package. All documentation becomes dated, and this manual is no exception. Finish matte tin plated leads, solderable per milstd202, method 208 package view. Soj 32 a42 soj loc 32 soic 8 cu package type j a cw 0 10 20 30 40 50 60 1s 2s2p % shift 216 108 % shift. Hm621664hb 1m high speed sram components datasheet pdf data sheet free from datasheet data sheet search for integrated circuits ic, semiconductors and other electronic components such as resistors, capacitors, transistors and diodes.
Samsung semiconductor is a south korean multinational electronics company headquartered in suwon, south korea. Kynix will provide you the global and original as7c4s stock information, reference price, package lot no. Dual inline package glass sealed dual inline packages are called cerdip package. Some package types have standardized dimensions and. List of integrated circuit packaging types wikipedia. Available ground shielded top and bottom 6pin soj20 footprint jleads seamsealed, resistance welded hermetic package obsolete mtronpti reserves the right to make changes to the products and. Hy51v16404cj60 datasheets hynix pdf price in stock by apogeeweb, hy51v16404cj60 pdf, sk hynix ram, sk hynix ssd, sk hynix ddr4, memory drams, edo dram. The plastic small outline package psop, thin small outline package tsop, and shrink small outline package ssop are the surface mount memory packaging from intel. As7c31025 datasheet 142 part ecad model manufacturer. Is61wv25616edbll is64wv25616edbll features highspeed access time. Parameter 5 description test conditions 44pin soj package 44pin tsop ii package unit 4ja thermal resistance junction to ambient still air, soldered on a 3. The convention for naming the package is soic or so followed by the number of pins.
Tape and package drawings are not to scale and are shown for device tape orientation only. You will view the photos of products from stock suppliers. Package information datasheet for altera devices intel. Embossed carrier tape specifications tape width w dimension value mm dimension value mm dimension value mm 8mm b1 4. General description the 74avc1t45 is a single bit, dual supply transceiver with 3state output that enables bidirectional level translation. Package 44pin soj package 44pin tsop ii package unit ja thermal resistance junction to ambient still air, soldered on a 3. Tis broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies, from traditional bga and ceramics, to advanced wcsp, qfn, sip, modules, power packages and more. A small outline integrated circuit soic is a surfacemounted integrated circuit ic package which occupies an area about 3050% less than an equivalent dual inline package dip, with a typical thickness being 70% less. Microchip products meet the specification contained in their particular microchip. The 238 can be used as an eight output demultiplexer by using one of the active low enable inputs as the data input and the remaining enable inputs as strobes.
Overall honesty integrating system will help you order as7c4 with more confidence, please order as7c4. Available in 44pin, 400 mil plastic soj package and a 44pin, 400 mil tsop type ii package and a 48 ball grid array, 9mm x 9mm package. Standard dualinline packages dip, which fulfill these basic requirements, have enjoyed wide usage. D page 6 of 18 capacitance parameter7 description test conditions 48ball vfbga 44pin soj 44pin tsop ii unit cin input capacitance ta 25 c, f 1 mhz, vcc vcctyp 10 10 10 pf cout io capacitance 10 10 10 pf thermal resistance parameter7 description test conditions 48ball vfbga 44pin soj 44pin tsop ii unit. Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. Gm71c18163cj6 gm71c17403cj6 gm71v18163ct6 1m x 16 edo ram gm71v16403cj60 gm71c18163cj6 gm71v16163ct6 gm71v17403cj6 4m dram edo. Small outline integrated circuits soic, ssop, xsop, xso. Package classifications 3 100 80 60 40 20 1995 2000 2005 throughhole mounting type package dip, zip, sip, pga, etc. Operated at commercial and industrial temperature ranges. Some package types have standardized dimensions and tolerances, and are. Every output will be low unless e1 and e2 are low and. Product catalog 2018 worldwide leader in legacy memory. There is no relevant information available for this part yet.
Edi88128lpsxcb datasheetpdf 1 page white electronic. An integrated circuit or monolithic integrated circuit also referred to as an ic, a chip, or a microchip is a set of electronic circuits on one small plate chip of semiconductor material, normally silicon. As7c31025 datasheet, cross reference, circuit and application notes in pdf format. Gs74108atpjx512k x 84mb asynchronous sram8, 10, 12 ns3.
Plastic ball grid array package 544 pin plastic 544pin plastic pbga lead pitch 1. Available in 44pin plastic soj, 44pin tsop, and 48ball plastic fbga packages description the idt71v016 is a 1,048,576bit highspeed static ram organized as 64k x 16. The cy7c185 is in a standard 300milwide dip, soj, or soic package. It is fabricated using idts highperfomance, highreliability cmos technology. Overall honesty integrating system will help you order gm71c with more confidence, please order gm71c. Package information datasheet for mature altera devices. Datasheet search engine for electronic components and semiconductors. Lcd controller mobile graphics engines product roadmap.
Is41lv16100b60tl issi, integrated silicon solution inc. It features two 1bit inputoutput ports a and b, a direction control. This can be made much smaller than a discrete circuit made from independent. Vsop very small outline package refers to packages with high density. Sumitomo eme6600hr soj package msl 6600hr eme 6600hr mold compound eme6600hr qmi 509 epoxy datasheet jesd22 cy7c63001asc text. White electronic designsedi88128csfebruary 2000rev. D42275alfa15 nec nec corporation jotrin electronics. A standardsized 8pin dual inline package dip containing a 555 ic. Buy upd431016le17b nec, view the manufacturer, and stock, and datasheet pdf for the upd431016le17b at jotrin electronics. Pdf soj28 11256l 11v256c 71028t 71024t soj32 tsop 173 g t 9527 soj28 datasheet of ic 741 a110 a106 a104 a102 a101 9438 diode. A 14 pages, 1009 kb 20120828 view opa2107au as design reference 52 pages, 1681 kb 20171106 view.
The engineers will enjoy the small batch ordering service for as7c4 from stock suppliers here. Ic dram 16mbit 60ns 44tsop online from elcodis, view and download is41lv16100b60tl pdf datasheet, memory specifications. Package information mechanical data surface mount package weight. Available in 44pin soj package and 44pin tsop type ii commercial, industrial and automotive temperature ranges available leadfree available description the issi is61c25616alas and is64c25616alas are highspeed, 4,194,304bit static rams organized as 262,144 words by 16 bits. Gm71c online ordering gm71c brand manufactures pdf. This multiple enable function allows easy parallel expansion to a 1of32 5 to 32 lines decoder with just four 238 ics and one inverter. A very large number of different types of package exist. It is fabricated using highperformance, highreliability cmos technology. Due to some circular ownership, it is the flagship company of the samsung chaebol.
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